Silicon wafers, chips, and high-performance semiconductors are highly sensitive electronic components. As these technologies have developed, so has low-pressure plasma technology as a manufacturing process.
The enhancement of the Openair® Plasma process under atmospheric pressure opens up entirely new possibilities, in particular for automation. A vacuum is no longer required for plasma treatment, so process flows can be greatly simplified.
Put Openair-Plasma® to the test with our rental and test systems.
How to measure surface energy with test ink.
International Trade Fair for Bonding Technology
Hall 5, Booth 5503
StuttgartGermany
Plasmatreat constantly faces shifting demands as a result of new ideas, regulations, and standards. Customers are increasingly approaching the company with unique and innovative project requests. Consequently, the capacities of the technology and research center will now be expanded to include a class-6 cleanroom.
Plasmatreat supports digitized manufacturing with its Plasma Control Unit (PCU) and makes numerous controls, regulation, and monitoring functions available to ensure consistently high surface-treatment quality and reproducibility.
VOCs occur when solvents and solvent-containing products are used, and they are harmful to the environment. Nevertheless, manufacturing in many industries still involves pre-treating surfaces with primers, bonding agents or other chemicals that release VOCs. With its Openair-Plasma process, Plasmatreat offers an environmentally friendly alternative.
